Filoform Fill & Seal compound is a high quality, flexible and strong one-component product. The Filoform glueing and sealing compound is based on a hybrid MS-polymer.
After application the compound cures with atmospheric moisture to form a durable, high-levelled elastomer.
Applications for Fill & Seal compound are telecom technique, cable ducts, wall ducts, gastight and watertight sealing for centre plugs and duct plugs. Also used as a glueing and sealing compound in construction and shipbuilding industry.
Technical specifications | ||
Density | 1,6 gr/cm³ | |
Thixotropic | good | |
Colour | white | |
Skin hardening | ± 10 minutes | |
Hardening | 3mm / 24 hours | |
Hardness | 55 shore A | DIN 53504 |
Elongation | 250% | DIN 53504 |
Tensile strength | 1,7 N/mm | DIN 53504 |
Volume change | < 3% | DIN 52451 |
Shear strength | 2,5 N/mm² | |
Operating temperature | +5°C till +40°C | |
Temperature resistance | -40°C till +120°C |
More information | Verwerking: de ondergrond moet schoon, droog, stof- en vetvrij zijn, ondergrond bij voorkeur opruwen. |
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